1. 2. 3. material content data sheet sales product name ipb70n10s3l-12 issued 29. august 2013 ma# MA000380136 package pg-to263-3-2 weight* 1560.51 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.755 0.37 0.37 3688 3688 leadframe non noble metal iron 7439-89-6 0.304 0.02 195 inorganic material phosphorus 7723-14-0 0.091 0.01 59 non noble metal copper 7440-50-8 304.026 19.48 19.51 194825 195079 wire non noble metal aluminium 7429-90-5 5.464 0.35 0.35 3502 3502 encapsulation organic material carbon black 1333-86-4 10.229 0.66 6555 plastics epoxy resin - 112.520 7.21 72105 inorganic material silicondioxide 60676-86-0 559.191 35.81 43.68 358338 436999 leadfinish non noble metal tin 7440-31-5 9.657 0.62 0.62 6188 6188 plating non noble metal nickel 7440-02-0 0.228 0.01 146 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 146 solder noble metal silver 7440-22-4 0.117 0.01 75 non noble metal tin 7440-31-5 0.093 0.01 60 non noble metal lead 7439-92-1 4.452 0.29 0.31 2853 2988 heatspreader inorganic material phosphorus 7723-14-0 0.165 0.01 105 non noble metal iron 7439-89-6 0.548 0.04 351 non noble metal copper 7440-50-8 547.666 35.10 35.15 350954 351410 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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